Dalian Jafeng Semiconductor Device Co., Ltd

Company Description

Dalian Jafeng electronics co., ltd, focusing on the R&D, manufacture with sale of semiconductor back-end package equipment, is one professional manufacturer of die bonders which are used for the Transistor, ICs、LED、Crystal Oscillator, IC card etc package. It sells Dalian Jafeng Semiconductor Device Co., Ltdll due to its high quality, competitive price, and so we win the most of the VIP by its advance technology, high reliability and excellent working team in short time. Our products are: *Soft Solder Die Bonders---for Transistor Package: TO-126 TO-220 TO-23 TO-3P etc; *Epoxy Die Bonder---for IC LED DIP SOP SIP TSOP QFP LQFP PLCC SSOP BGA IC Card Crystal Oscillator etc package; *COG Bonder--- For LCD package; *RFID Flip Chip Bonder---For Flip Chip package; sheilawu2009at *****

Company Information

  • Contact Person:Ms. sheila wu
  • Department:Manager
  • Telephone:
  • Fax:
  • Zip:116025
  • Business Type:Manufacturing
  • Year Established:2001
  • Number Of Employees:51-100
  • Trade Capacity:Export Percentage:
  • Certificates:CE, ISO9000, SEMI
  • Legal Representative / CEO:Die bonder
  • Main Products:Die Bonder,Die Attach, Semicondutor Assembly, Electronics Package, Ics And Transistor Package,
  • Address:high-tech zone, dalian, liaoning, China
  • Main Markets:Worldwide
  • Website:Visit website

Product

  • Die bonder used for ICs and LED Package
  • Die bonder used for Transistor Package
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