DNC Engineering Co., Ltd.
Company Description
CSP/LOC Die bonder is for LOC packaging process with Leadframe substrate and CSP process with film or PWB substrate.
Company Information
- Contact Person:Kyoungwook Kim
- Job Title:Managing Director
- Telephone:
- Fax:
- Business Type:Manufacturer
- Year Established:2000
- Number Of Employees:11 - 50
- Total Annual Sales Volume:USD 2,000,001 - 5,000,000
- Main Products:Machine Die Bonder Handler, Tester
- Address:107, Anyangmegavally, 799, Gwanyang-dong, Dongan-gu Anyang-si Gyeonggi-do 431-060 Korea
- Website:Visit website
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