Engineering Techniques, Inc.

Company Description

Ultra precision fine wire EDM, general wire EDM cutting. EDM sinker and hole popping. General machining, CNC lathe, Mill.
25 years R& D service to disk drive makers, electronics industry, biomedical industry, aerospace.
Service to Hewlett Packard, IBM, GE, Lockheed, Seagate, Quantum Corp. , Engineering Techniques, Inc.stern Digital.

Company Information

Contact Person:Mr. Marsh Syverson
Department:Director/CEO/General Manager
Job Title:President
Telephone:
Mobile Phone:
Fax:
Zip:95136
Province/State:California
City:San Jose
Business Type:Manufacturer
Year Established:1980
Number Of Employees:Fewer than 5 People
Total Revenue:Below US$1 Million
Trade Capacity:North America : 100.00%
Production Capacity:Factory Size : Below 1,000 square meters No. of Pr
R&D Capacity:No. of R&D Staff :Less than 5 People
Main Products:Fine Wire EDM, General Machining,EDM SInker,Wire EDM Cutting,Profiling
Address:3751-A Charter Park Court
Main Markets:North America
Location:California, United States
Website:Visit website

Product

Qualification photos at high X to verify inspection parameters
CNC optical inspection to 538x, CCD inspection to 1000x
Ultra high precision R & D and prototype
Slotting and profiling to .0008 inch wide (20um)
Hole popping, EDM engraving
Sinker EDM cavities, Plunge EDM, EDM contours
Standard and Ultra Fine Wire EDM cutting, slotting and profiling
Wire EDM cutting, profiling, sinker EDM Service

Category

Countries

United States All Countries