Company Description
Engion, established Aug. 2003, has Semiconductor Biz Div. and System Biz Div.
In Semiconductor Biz Div., Engion provide foundary service for wafer back-end process such as Back-Grinding, Sawing, Reconstruction, and Chip-sorting (Pick & Place COG).
In System Biz Div, with Engion's own unique algorithm for defect location, Engion's system provide superior performance on Automative Macro inspection system.
Company Information
- Contact Person:KIM HYUNGSIK
- Job Title:Director
- Telephone:
- Fax:
- Business Type:Manufacturer
- Year Established:2003
- Number Of Employees:101 - 500
- Total Annual Sales Volume:USD 2,000,001 - 5,000,000
- Main Products:Wafer Processing Service, Inspection Equipment,Probe Mark, Inspection System Pad, CIS,Image Sensor,Mura, Inspection System
- Address:#1-511, 306, Sinwon-ro, Yeongtong-gu Suwon-si Gyeonggi-do 363-883 Korea
- Website:Visit website