Engion Co., Ltd.

Company Description



Engion, established Aug. 2003, has Semiconductor Biz Div. and System Biz Div.

In Semiconductor Biz Div., Engion provide foundary service for wafer back-end process such as Back-Grinding, Sawing, Reconstruction, and Chip-sorting (Pick & Place COG).

In System Biz Div, with Engion's own unique algorithm for defect location, Engion's system provide superior performance on Automative Macro inspection system.

Company Information

  • Contact Person:KIM HYUNGSIK
  • Job Title:Director
  • Telephone:
  • Fax:
  • Business Type:Manufacturer
  • Year Established:2003
  • Number Of Employees:101 - 500
  • Total Annual Sales Volume:USD 2,000,001 - 5,000,000
  • Main Products:Wafer Processing Service, Inspection Equipment,Probe Mark, Inspection System Pad, CIS,Image Sensor,Mura, Inspection System
  • Address:#1-511, 306, Sinwon-ro, Yeongtong-gu Suwon-si Gyeonggi-do 363-883 Korea
  • Website:Visit website
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