Flexible Printed Circuit ED Copper Thin Sheet , 35um ID76mm Copper Foil Paper

very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit. Surface: Mill,mirror,brush,hair line,checkered .etc Main Purpose: Copper strip can be made to do all sorts of deep drawing and bending stress components, such as manufacturing pins,rivets, gasket, nuts, conduits, the barometer spring, screen, radiator parts, etc The product surface is black or red, has lower surface roughness,high density, high bending resistance and good etching performance, used for Flexible Copper Clad Laminate(FCCL),Fine Circuit FPC,LED coated crystal thin film. Products usage: - Flexible Printed Circuit. - LED layer of HDI . ED copper foil Specifications. 1) Thickness Range: 0.035mm. 2) standard width:1290mm. 3) ID: 76 mm,152 mm. 4) Cu Content: 99.8%. VLP ED Copper Foil Characteristics. 1. Zinc-free. 2. Excellent physics of high elongation Performance. Difference between rolled copper foil and electrolytic copper foil. Process is difference: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process). Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm. Typical properties of VLP-S-B/R copper foil for FPC or inner layer of HDI. Classification Unit Requirement Test Method Foil Designation / 1 H M 1 IPC-4562A Nominal thickness / 10um 12um 1/2 OZ (18um) 3/4 OZ(25um) 1 OZ(35um) IPC-4562A Area Weight g/㎡ 98±4 107±4 153±5 228±8 285±10 IPC-TM-650 2.2.12.2 Purity ％ ≥99.8 IPC-TM-650 2.3.15 Foil Profile Shiny side(Ra) սm ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5 IPC-TM-650 2.3.17 Matte side(Rz) um ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5 Tensile Strength R.T.(23℃) Mpa ≥300 ≥300 ≥300 ≥300 ≥300 IPC-TM-650 2.3.18 H.T.(180℃) Mpa ≥200 ≥200 ≥200 ≥200 ≥200 Elongation R.T.(23℃) ％ ≥4 ≥5